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Different process Xiangjie PCB circuit board variety
发布时间：2016-08-17 21:02
Mainly introduced in this paper: single-sided circuit board, double sided board HASL, double-sided nickel gold plate, multilayer board HASL, multilayer nickel gold plate, multilayer board sink nickel gold plate. These circuits in different process do detailed introduction.
1, single panel process
Cutting grinding side, hole drilling, outer graphics, (in gold), etching, examination, screen printing solder, (HASL), screen printing character, shape processing, testing, inspection.
2, double sided HASL process
Cutting grinding side, hole drilling, heavy copper thick, outer graphics, tin plating, etching back tin, secondary hole drilling, examination, screen printing solder, gold-plated plugs, hot air leveling, silk screen characters, shape processing, testing, inspection.
3, double-sided plate nickel plating process
Cutting edge grinding, drilling, heavy copper thickening, outer pattern, nickel plating, gold plating film etching, two drilling, inspection, screen printing, resistance welding, screen printing characters, contour processing, testing and testing.
4, multilayer board HASL process
Cutting grinding edge, drill positioning holes, the inner graphics, inner layer etching, examination, blackening, lamination, hole drilling, heavy copper thick, outer graphics, tin plating, etching back tin, secondary hole drilling, examination, screen printing solder, gold-plated plugs, hot air leveling, silk screen characters, shape processing, testing, inspection.
5, multilayer nickel gold plating process
Cutting grinding edge, drill positioning holes, the inner graphics, inner layer etching, examination, blackening, lamination, hole drilling, heavy copper thick, outer graphics, gold-plated, to film etching, secondary hole drilling, examination, screen printing solder, silk screen characters, shape processing, testing, inspection.
6, multilayer board nickel gold plate process
Cutting grinding edge, drill positioning holes, the inner graphics, inner layer etching, examination, blackening, lamination, hole drilling, heavy copper thick, outer graphics, tin plating, etching back tin, secondary hole drilling, test, screen printing solder, chemical nickel gold, silk screen characters, shape processing, testing, test sink.